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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. TPA6204A1 slos429c ? may 2004 ? revised may 2016 TPA6204A1 1.7-w mono fully differential audio power amplifier 1 1 features 1 ? designed for wireless or cellular handsets and pdas ? 1.7 w into 8 from a 5-v supply at thd = 10% (typical) ? low supply current: 4 ma typical at 5 v ? shutdown current: 0.01 a typical ? fast start-up with minimal pop ? only three external components ? improved psrr ( ? 80 db) and wide supply voltage (2.5 v to 5.5 v) for direct battery operation ? fully differential design reduces rf rectification ? ? 63-db cmrr eliminates two input coupling capacitors ? pin-to-pin compatible with tpa2005d1 and tpa6211a1 in son package ? available in 3 mm 3 mm son package (drb) 2 applications ? ideal for wireless handsets ? pdas ? notebook computers 3 description the TPA6204A1 device (sometimes referred to as tpa6204) is a 1.7-w mono fully-differential amplifier designed to drive a speaker with at least 8- impedance while consuming only 20 mm 2 total printed-circuit board (pcb) area in most applications. the device operates from 2.5 v to 5.5 v, drawing only 4 ma of quiescent supply current. the TPA6204A1 (tpa6204) is available in the space- saving 3 mm 3 mm son (drb) package. the TPA6204A1 (tpa6204) is ideal for pda or smartphone applications due to features such as ? 80- db supply voltage rejection from 20 hz to 2 khz, improved rf rectification immunity, small pcb area, and a fast start-up with minimal pop. device information (1) part number package body size (nom) TPA6204A1 son (8) 3.00 mm 3.00 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. application circuit _+ v dd v o+ v o? gnd 65 8 7 to battery c s bias circuitry in?in+ 43 2 + ? in from dac shutdown r r i i 1 c (bypass) (1) 100 k 40 k 40 k (1) c (bypass) is optional. copyright ? 2016, texas instruments incorporated productfolder sample &buy technical documents tools & software support &community
2 TPA6204A1 slos429c ? may 2004 ? revised may 2016 www.ti.com product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 device comparison table ..................................... 3 6 pin configuration and functions ......................... 3 7 specifications ......................................................... 3 7.1 absolute maximum ratings ...................................... 3 7.2 esd ratings .............................................................. 4 7.3 recommended operating conditions ....................... 4 7.4 thermal information .................................................. 4 7.5 electrical characteristics: t a = 25 c ........................ 4 7.6 operating characteristics: t a = 25 c, gain = 1 v/v 5 7.7 dissipation ratings ................................................... 5 7.8 typical characteristics .............................................. 6 8 parameter measurement information .................. 8 9 detailed description .............................................. 9 9.1 overview ................................................................... 9 9.2 functional block diagram ......................................... 9 9.3 feature description ................................................... 9 9.4 device functional modes ........................................ 12 10 application and implementation ........................ 13 10.1 application information .......................................... 13 10.2 typical application ................................................ 13 10.3 system examples ................................................. 15 11 power supply recommendations ..................... 16 11.1 power supply decoupling capacitor .................... 17 12 layout ................................................................... 17 12.1 layout guidelines ................................................. 17 12.2 layout example .................................................... 17 13 device and documentation support ................. 18 13.1 community resources .......................................... 18 13.2 trademarks ........................................................... 18 13.3 electrostatic discharge caution ............................ 18 13.4 glossary ................................................................ 18 14 mechanical, packaging, and orderable information ........................................................... 18 4 revision history changes from revision b (september 2009) to revision c page ? added esd ratings table, feature description section, device functional modes , application and implementation section, power supply recommendations section, layout section, device and documentation support section, and mechanical, packaging, and orderable information section. ................................................................................................. 1
3 TPA6204A1 www.ti.com slos429c ? may 2004 ? revised may 2016 product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated 5 device comparison table device number tpa6203a1 TPA6204A1 tpa6205a1 (1.8-v comp sd) tpa6211a1 speaker channels mono mono mono mono output power (w) 1.25 1.7 1.25 3.1 psrr (db) 90 85 90 85 pin/package 8bga, 8msop, 8son 8son 8bga, 8msop, 8son 8msop, 8son 6 pin configuration and functions drb package 8-pin son top view pin functions pin i/o description name no. bypass 2 ? mid-supply voltage, adding a bypass capacitor improves psrr in ? 4 i negative differential input in+ 3 i positive differential input gnd 7 i high-current ground shutdown 1 i shutdown terminal (active low logic) thermal pad ? ? connect to ground. thermal pad must be soldered down in all applications to properly secure device on the pcb. v dd 6 i power supply v o+ 5 o positive btl output v o ? 8 o negative btl output (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions . exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 specifications 7.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (1) min max unit supply voltage, v dd ? 0.3 6 v input voltage, v i ? 0.3 v dd + 0.3 v continuous total power dissipation see dissipation ratings operating free-air temperature, t a ? 40 85 c junction temperature, t j ? 40 150 c storage temperature, t stg ? 65 150 c 8 shutdown bypass in+ in? v o? gndv dd v o+ 76 5 12 3 4
4 TPA6204A1 slos429c ? may 2004 ? revised may 2016 www.ti.com product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 7.2 esd ratings value unit v (esd) electrostatic discharge human-body model (hbm), per ansi/esda/jedec js-001 (1) 4000 v charged-device model (cdm), per jedec specification jesd22-c101 (2) 1500 7.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min max unit supply voltage, v dd 2.5 5.5 v high-level input voltage, v ih shutdown 1.55 v low-level input voltage, v il shutdown 0.5 v operating free-air temperature, t a ? 40 85 c (1) for more information about traditional and new thermal metrics, see the semiconductor and ic package thermal metrics application report, spra953 . 7.4 thermal information thermal metric (1) TPA6204A1 unit drb (son) 8 pins r ja junction-to-ambient thermal resistance 50.3 c/w r jc(top) junction-to-case (top) thermal resistance 69.2 c/w r jb junction-to-board thermal resistance 25.5 c/w jt junction-to-top characterization parameter 1.8 c/w jb junction-to-board characterization parameter 25.6 c/w r jc(bot) junction-to-case (bottom) thermal resistance 6.7 c/w 7.5 electrical characteristics: t a = 25 c over operating free-air temperature range (unless otherwise noted) parameter test conditions min typ max unit v os output offset voltage (measured differentially) v i = 0 v differential, gain = 1 v/v, v dd = 5.5 v ? 9 0.3 9 mv psrr power supply rejection ratio v dd = 2.5 v to 5.5 v ? 85 ? 60 db v ic common mode input range v dd = 2.5 v to 5.5 v 0.5 v dd ? 0.8 v cmrr common mode rejection ratio v dd = 5.5 v, v ic = 0.5 v to 4.7 v ? 63 ? 40 db v dd = 2.5 v, v ic = 0.5 v to 1.7 v ? 63 ? 40 low-output swing r l = 8 , v in+ = v dd , gain = 1 v/v, v in ? = 0 v or v in+ = 0 v, v in ? = v dd v dd = 5.5 v 0.45 v v dd = 3.6 v 0.37 v dd = 2.5 v 0.26 0.4 high-output swing r l = 8 , v in+ = v dd , gain = 1 v/v, = 0 v or v in ? = v dd vin ? v in+ = 0 v v dd = 5.5 v 4.95 v v dd = 3.6 v 3.18 v dd = 2.5 v 2 2.13 | i ih | high-level input current, shutdown v dd = 5.5 v, vi = 5.8 v 58 100 a | i il | low-level input current, shutdown v dd = 5.5 v, vi = ? 0.3 v 3 100 a i q quiescent current v dd = 2.5 v to 5.5 v, no load 4 6 ma i (sd) supply current v( shutdown) 0.5 v, v dd = 2.5 v to 5.5 v, r l = 8 0.01 1 a gain r l = 8 38 k / r i 40 k / r i 42 k / r i v/v resistance from shutdown to gnd 100 k
5 TPA6204A1 www.ti.com slos429c ? may 2004 ? revised may 2016 product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated 7.6 operating characteristics: t a = 25 c, gain = 1 v/v over operating free-air temperature range (unless otherwise noted) parameter test conditions min typ max unit p o output power thd + n = 1%, f = 1 khz, r l = 8 v dd = 5.5 v 1.36 w v dd = 3.6 v 0.72 v dd = 2.5 v 0.33 thd + n = 10%, f = 1 khz, r l = 8 v dd = 5.5 v 1.7 w v dd = 3.6 v 0.85 v dd = 2.5 v 0.4 thd+n total harmonic distortion + noise v dd = 5 v, po = 1 w, r l = 8 , f = 1 khz 0.02% v dd = 3.6 v, po = 0.5 w, r l = 8 , f = 1 khz 0.02% v dd = 2.5 v, po = 200 mw, r l = 8 , f = 1 khz 0.03% k svr supply ripple rejection ratio v dd = 3.6 v, inputs ac-grounded with c i = 2 f, v (ripple) = 200 mv pp f = 217 hz ? 80 db f = 20 hz to 20 khz ? 70 snr signal-to-noise ratio v dd = 5 v, p o = 1 w, r l = 8 105 db v n output voltage noise v dd = 3.6 v, f = 20 hz to 20 khz, inputs ac-grounded with c i = 2 f no weighting 15 v rms a weighting 12 cmrr common-mode rejection ratio v dd = 3.6 v v ic = 1 v pp f = 217 hz ? 65 db r f feedback resistance 38 40 44 k start-up time from shutdown v dd = 3.6 v, c bypass = 0.1 f 27 ms 7.7 dissipation ratings package t a 25 c power ratings derating factor t a = 70 c power ratings t a = 85 c power ratings drb 2.7 w 21.8 mw/ c 1.7 w 1.4 w
6 TPA6204A1 slos429c ? may 2004 ? revised may 2016 www.ti.com product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated 7.8 typical characteristics table 1. table of graphs figure p o output power vs supply voltage figure 1 vs load resistance figure 2 p d power dissipation vs output power figure 3 thd+n total harmonic distortion + noise vs output power figure 4 vs frequency figure 5 vs common-mode input voltage figure 6 k svr supply voltage rejection ratio vs frequency figure 7 gsm power supply rejection vs time figure 8 gsm power supply rejection vs frequency figure 9 closed-loop gain/phase vs frequency figure 10 open-loop gain/phase vs frequency figure 11 i dd supply current vs supply voltage figure 12 vs shutdown voltage figure 13 start-up time vs bypass capacitor figure 14 figure 1. output power vs supply voltage figure 2. output power vs load resistance figure 3. power dissipation vs output power figure 4. total harmonic distortion + noise vs common- mode input voltage 0.04 0.044 0.048 0.052 0.056 0.06 0 1 2 3 4 5 f = 1 khz p o = 200 mw, r l = 1 khz v ic ? common mode input voltage ? v thd+n ? total harmonic distortion + noise ? % v dd = 3.6 v v dd = 5 v v dd = 2.5 v 0 0.2 0.4 0.6 0.8 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 ? power dissipation ? w p d p ? o output power ? w 5 v 3.6 v 8 w r ? l load resistance ? ? output power ? w p o 0 0.5 1 1.5 2 2.5 3 3.5 8 13 18 23 28 v dd = 5 v, thd 1% v dd = 2.5 v, thd 10% v dd = 2.5 v, thd 1% v dd = 5 v, thd 10% v dd = 3.6 v, thd 10% v dd = 3.6 v, thd 1% f = 1 khz gain = 1 v/v 0 0.5 1 1.5 2 2.5 3 3.5 2.5 3 3.5 4 4.5 5 v dd ? supply voltage ? v ? output power ? w p o f = 1 khz gain = 1 v/v p o = 8 , thd 1% p o = 8 , thd 10%
7 TPA6204A1 www.ti.com slos429c ? may 2004 ? revised may 2016 product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated figure 5. total harmonic distortion + noise vs output power figure 6. total harmonic distortion + noise vs frequency figure 7. supply voltage rejection ratio vs frequency figure 8. gsm power supply rejection vs frequency figure 9. gsm power supply rejection vs time figure 10. start-up time vs bypass capacitor c1frequency 217 hz c1 ? duty 20% c1 pk?pk 500 mv ch1 100 mv/div ch4 10 mv/div 2 ms/div v dd v out voltage ? v t ? time ? ms r l = 8 c i = 2.2 f c (bypass) = 0.47 f 0 50 100 150 200 250 300 0 0.2 0.4 0.6 0.8 1 c (bypass) ? bypass capacitor ? f start-up t ime ? ms f ? frequency ? hz +0 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 20 20k 50 100 200 500 1k 2k 5k 10k k svr ? supply voltage rejection ratio ? db v dd = 3.6 v v dd = 2.5 v v dd = 5 v r l = 8 , c (bypass) = 0.47 f, gain = 1 v/v, c i = 2 f, inputs ac grounded ?180 ?160 ?140 ?120 ?100 0 400 800 1200 1600 2000 ?150 ?100 ?50 0 f ? frequency ? hz ? supply voltage ? dbv v v dd shown in figure 9, r l = 8 , c i = 2.2 f, inputs grounded ? output voltage ? dbv v o c (bypass) = 0.47 f 0.01 20 0.02 0.05 0.1 0.2 0.5 1 2 5 10 10m 20m 50m 100m 200m 500m 1 2 p ? o output power ? w thd+n ? total harmonic distortion + noise ? % 2.5 v 3.6 v 5 v r l = 8 , c (bypass) = 0 to 1 f, gain = 1 v/v f = 1khz 0.001 10 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 20 20k 50 100 200 500 1k 2k 5k 10k f ? frequency ? hz thd+n ? total harmonic distortion + noise ? % 0.1 w 0.6 w 0.25 w v dd = 3.6 v, r l = 8 , c , (bypass) = 0 to 1 f, gain = 1 v/v, c i = 2 f
8 TPA6204A1 slos429c ? may 2004 ? revised may 2016 www.ti.com product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated figure 11. closed-loop gain/phase vs frequency figure 12. open-loop gain/phase vs frequency figure 13. supply current vs supply voltage figure 14. supply current vs supply voltage 8 parameter measurement information all parameters are measured according to the conditions described in specifications . 0.00001 0.0001 0.001 0.01 0.1 1 10 0 1 2 3 4 5 v dd = 3.6 v v dd = 5 v v dd = 2.5 v voltage on shutdown terminal ? v i dd ? supply current ? ma 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 t a = 25 c t a = ?40 c t a = 125 c v dd = 5 v v dd ? supply voltage ? v i dd ? supply current ? ma ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 0 10 20 30 40 ?180 ?150 ?120 ?90 ?60 ?30 0 30 60 90 120 150 180 1 100 10 k 100 k 1 m 10 m 1 k f ? frequency ? hz gain ? db phase degrees gain phase v dd = 5 v r l = 8 gain = 1 10 C C ?40 ?30 ?20 ?10 0 10 20 30 40 50 60 70 80 90 100 ?180 ?150 ?120 ?90 ?60 ?30 0 30 60 90 120 150 180 v dd = 5 v, r l = 8 gain phase 100 1 k 10 k 100 k 1 m f ? frequency ? hz phase ? degrees gain ? db
9 TPA6204A1 www.ti.com slos429c ? may 2004 ? revised may 2016 product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated 9 detailed description 9.1 overview the TPA6204A1 is a fully differential amplifier with differential inputs and outputs. the fully differential amplifier consists of a differential amplifier and a common-mode amplifier. the differential amplifier ensures that the amplifier outputs a differential voltage that is equal to the differential input times the gain. the common-mode feedback ensures that the common-mode voltage at the output is biased around vdd/2 regardless of the common-mode voltage at the input. 9.2 functional block diagram 9.3 feature description 9.3.1 advantages of fully differential amplifiers ? input coupling capacitors not required: a fully differential amplifier with good cmrr, like the TPA6204A1, allows the inputs to be biased at voltage other than mid-supply. for example, if a dac has mid-supply lower than the mid-supply of the TPA6204A1, the common-mode feedback circuit adjusts for that, and the TPA6204A1 outputs are still biased at mid-supply of the TPA6204A1. the inputs of the TPA6204A1 can be biased from 0.5 v to vdd ? 0.8 v. if the inputs are biased outside of that range, input coupling capacitors are required. ? mid-supply bypass capacitor, c(bypass), not required: the fully differential amplifier does not require a bypass capacitor. this is because any shift in the mid-supply affects both positive and negative channels equally and cancels at the differential output. it is important to remember that removing the bypass capacitor slightly worsens the ksvr. a slight decrease of ksvr, however, may be acceptable when an additional component can be eliminated. ? better rf-immunity: gsm handsets save power by turning on and shutting off the rf transmitter at a rate of 217 hz. the transmitted signal is picked up on input and output traces. the fully differential amplifier cancels the signal much better than the typical audio amplifier. 9.3.2 fully differential amplifier efficiency and thermal information class-ab amplifiers are inefficient. the primary cause of these inefficiencies is voltage drop across the output stage transistors. there are two components of the internal voltage drop. one is the headroom or dc voltage drop that varies inversely to output power. the second component is due to the sinewave nature of the output. the total voltage drop can be calculated by subtracting the rms value of the output voltage from vdd. the internal voltage drop multiplied by the average value of the supply current, idd(avg), determines the internal power dissipation of the amplifier. bias circuitry + - shutdown
10 TPA6204A1 slos429c ? may 2004 ? revised may 2016 www.ti.com product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated feature description (continued) an easy-to-use equation to calculate efficiency starts out as being equal to the ratio of power from the power supply to the power delivered to the load. to accurately calculate the rms and average values of power in the load and in the amplifier, the current and voltage waveform shapes must first be understood (see figure 15 ). figure 15. voltage and current waveforms for btl amplifiers although the voltages and currents for se and btl are sinusoidal in the load, currents from the supply are different between se and btl configurations. in an se application the current waveform is a half-wave rectified shape, whereas in btl it is a full-wave rectified waveform. this means rms conversion factors are different. keep in mind that for most of the waveform both the push and pull transistors are not on at the same time, which supports the fact that each amplifier in the btl device only draws current from the supply for half the waveform. figure 13 and are the basis for calculating amplifier efficiency. where where ? p l = power delivered to load ? v lrms = rms voltage on btl load ? r l = load resistance ? v p = peak voltage of btl load and where ? p sup = power drawn from power supply ? r l = load resistance ? v p = peak voltage of btl load ? i dd avg = average current drawn from the power supply ? v dd = power supply voltage therefore, (2) substituting p l and p sup in equation 5 , dd p sup l v v p r 2 = p p p p sup dd dd dd l l l v v v p v i avg and i avg t dt = t = r r r 1 0 0 2 1 sin( ) [cos( )] p p p = = - p p l p p l lrms l l l v rms v v p and v = therefore, p = r r 2 2 , , 2 2 = l sup p efficiency of a btl amplifier = p v (lrms) v o i dd i dd(avg)
11 TPA6204A1 www.ti.com slos429c ? may 2004 ? revised may 2016 product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated feature description (continued) where therefore, where ? btl = efficiency of a btl amplifier (4) table 2 and table 3 employ equation 5 to calculate efficiencies for four different output power levels. note that the efficiency of the amplifier is quite low for lower power levels and rises sharply as power to the load is increased resulting in a nearly flat internal power dissipation over the normal operating range. note that the internal dissipation at full output power is less than in the half power range. calculating the efficiency for a specific system is the key to proper power supply design. for a 1-w audio system with 8- loads and a 5-v supply, the maximum draw on the power supply is almost 1.6 w. a final point to remember about class-ab amplifiers is how to manipulate the terms in the efficiency equation to the utmost advantage when possible. a simple formula for calculating the maximum power dissipated, pdmax, may be used for a differential output application: (5) the p dmax for a 5-v, 8- system is 0.64 w. the maximum ambient temperature depends on the heat sinking ability of the pcb system. the derating factor for the 3 mm 3 mm drb package is shown in the dissipation rating table. converting this to r ja : (6) given r ja , the maximum allowable junction temperature, and the maximum internal dissipation, the maximum ambient temperature can be calculated with the following equation. the maximum recommended junction temperature for the TPA6204A1 is 150 c. (7) = 150 ? 45.9(0.64) = 120.6 c equation 7 shows that the maximum ambient temperature is 120.6 c (package limited to 85 c) at maximum power dissipation with a 5-v supply. table 2 shows that for most applications no airflow is required to keep junction temperatures in the specified range. the TPA6204A1 is designed with thermal protection that turns the device off when the junction temperature surpasses 150 c to prevent damage to the ic. in addition, using speakers with an impedance higher than 8- dramatically increases the thermal performance by reducing the output current. a j ja dmax t max = t max r p q - ja r = = = 45.9 c/w derating factor 1 1 0.0218 q o dd d l v p = r 2 max 2 2 p l l btl dd p r = v 2 4 p h p l l v = 2p r p l p dd p dd l v r v efficiency if a btl amplifer = = v v v r 2 2 2 4 p p
12 TPA6204A1 slos429c ? may 2004 ? revised may 2016 www.ti.com product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated feature description (continued) (1) drb package (2) package limited to 85 c ambient table 2. efficiency and maximum ambient temperature vs output power in 3.6-v 8- btl systems (1) output power (w) efficiency (%) internal dissipation (w) power from supply (w) max ambient temperature (2) ( c) 0.1 27.6 0.262 0.36 85 0.2 39.0 0.312 0.51 85 0.5 61.7 0.310 0.81 85 0.6 67.6 0.288 0.89 85 (1) drb package (2) package limited to 85 c ambient table 3. efficiency and maximum ambient temperature vs output power in 5-v 8- systems (1) output power (w) efficiency (%) internal dissipation (w) power from supply (w) max ambient temperature (2) ( c) 0.5 44.4 0.625 1.13 85 1 62.8 0.592 1.60 85 1.36 73.3 0.496 1.86 85 1.7 81.9 0.375 2.08 85 9.4 device functional modes 9.4.1 shutdown mode the TPA6204A1 can be put in shutdown mode when asserting shutdown pin to a logic low level. while in shutdown mode, the device is turned off, making the current consumption very low. the device exits shutdown mode when a high logic level is applied to shutdown pin.
13 TPA6204A1 www.ti.com slos429c ? may 2004 ? revised may 2016 product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated 10 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 10.1 application information the TPA6204A1 device starts its operation by asserting the shutdown pin to logic 1. the device enters in shutdown mode when pulling the shutdown pin low. this typical connection diagram highlights the required external components and system level connections for proper operation of the device in popular use case. any design variation can be supported by ti through schematic and layout reviews. visit e2e.ti.com for design assistance and join the audio amplifier discussion forum for additional information. 10.2 typical application figure 16 shows a typical circuit for the TPA6204A1 with a speaker, input resistors and supporting power supply capacitors. figure 16. typical differential input application schematic 10.2.1 design requirements table 4 lists the design parameters for this example. table 4. design parameters parameter example value power supply 2.5 v to 5 v current 1 a speaker 8 10.2.2 detailed design procedure 10.2.2.1 selecting components for resistors (r i ) the input resistor (ri) can be selected to set the gain of the amplifier according to equation 8 . gain = r f /r i (8) _+ v dd v o+ v o? gnd 65 8 7 to battery c s bias circuitry in?in+ 43 2 + ? in from dac shutdown r r i i 1 c (bypass) (1) 100 k 40 k 40 k (1) c (bypass) is optional. copyright ? 2016, texas instruments incorporated
14 TPA6204A1 slos429c ? may 2004 ? revised may 2016 www.ti.com product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated the internal feedback resistors (rf) are trimmed to 40 k . resistor matching is very important in fully differential amplifiers. the balance of the output on the reference voltage depends on matched ratios of the resistors. cmrr, psrr, and the cancellation of the second harmonic distortion diminishes if resistor mismatch occurs. therefore, ti recommends using 1% tolerance resistors or better to keep the performance optimized. 10.2.2.2 using low-esr capacitors low-esr capacitors are recommended throughout this applications section. a real (as opposed to ideal) capacitor can be modeled simply as a resistor in series with an ideal capacitor. the voltage drop across this resistor minimizes the beneficial effects of the capacitor in the circuit. the lower the equivalent value of this resistance the more the real capacitor behaves like an ideal capacitor. 10.2.2.2.1 bypass capacitor (c (bypass) ) and start-up time the internal voltage divider at the bypass pin of this device sets a mid-supply voltage for internal references and sets the output common-mode voltage to vdd/2. adding a capacitor to this pin filters any noise into this pin and increases ksvr. c (bypass) also determines the rise time of vo+ and vo ? when the device is taken out of shutdown. the larger the capacitor, the slower the rise time. figure 10 shows the relationship of c (bypass) to start-up time. 10.2.2.2.2 input capacitor (c i ) the TPA6204A1 does not require input coupling capacitors if using a differential input source that is biased from 0.5 v to vdd ? 0.8 v. use 1% tolerance or better gain-setting resistors if not using input coupling capacitors. in the single-ended input application an input capacitor, ci, is required to allow the amplifier to bias the input signal to the proper dc level. in this case, ci and ri form a high-pass filter with the corner frequency determined in equation 9 . (9) figure 17. ci and ri high-pass filter cutoff frequency the value of ci is important to consider as it directly affects the bass (low frequency) performance of the circuit. consider the example where ri is 10 k and the specification calls for a flat bass response down to 100 hz. equation 9 is reconfigured as equation 10 . (10) in this example, ci is 0.16 f, so one would likely choose a value in the range of 0.22 f to 0.47 f. ceramic capacitors should be used when possible, as they are the best choice in preventing leakage current. when polarized capacitors are used, the positive side of the capacitor must face the amplifier input in most applications, as the dc level there is held at vdd/2, which is likely higher than the source dc level. it is important to confirm the capacitor polarity in the application. i i c c = r f 1 2 p ?3 db f c c i i f = r c 1 2 p
15 TPA6204A1 www.ti.com slos429c ? may 2004 ? revised may 2016 product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated 10.2.2.2.3 decoupling capacitor (c s ) the TPA6204A1 is a high-performance cmos audio amplifier that requires adequate power supply decoupling to ensure the output total harmonic distortion (thd) is as low as possible. power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. for higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series resistance (esr) ceramic capacitor, typically 0.1 f to 1 f, placed as close as possible to the device vdd lead works best. for filtering lower frequency noise signals, a 10- f or greater capacitor placed near the audio power amplifier also helps, but is not required in most applications because of the high psrr of this device. 10.2.3 application curves for application curves, see the figures listed in table 5 . table 5. table of graphs figure p o output power vs supply voltage figure 1 vs load resistance figure 2 p d power dissipation vs output power figure 3 thd+n total harmonic distortion + noise vs output power figure 4 vs frequency figure 5 vs common-mode input voltage figure 6 k svr supply voltage rejection ratio vs frequency figure 7 gsm power supply rejection vs time figure 8 gsm power supply rejection vs frequency figure 9 closed-loop gain/phase vs frequency figure 10 10.3 system examples figure 18 through figure 19 show application schematics for differential and single-ended inputs. typical values are shown in table 6 . table 6. typical component values component value r i 40 k c (bypass) 0.22 f c s 1 f c i 0.22 f
16 TPA6204A1 slos429c ? may 2004 ? revised may 2016 www.ti.com product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated figure 18. differential input application schematic optimized with input capacitors (1) c (bypass) is optional (2) due to the fully differential design of this amplifier, the performance is severely degraded if you connect the unused input to bypass when using single-ended inputs. figure 19. single-ended input application schematic 11 power supply recommendations the TPA6204A1 is designed to operate from an input voltage supply range between 2.5 v and 5.5 v. therefore, the output voltage range of power supply must be within this range and well regulated. the current capability of upper power must not exceed the maximum current limit of the power switch. ti recommends placing decoupling capacitors in every voltage source pin. place these decoupling capacitors as close as possible to the TPA6204A1. in c i c i _+ v dd v o+ v gnd o ? 65 8 7 to battery c s bias circuitry in? in+ 4 32 shutdown r r i i 1 100 k 40 k 40 k c (bypass) (1) (1) c (bypass) is optional (2) due to the fully differential design of this amplifier, the performance is severly degraded if you connect the unused input to bypass when using single-ended inputs. _+ v dd v o+ v gnd o ? 65 8 7 to battery c s bias circuitry in?in+ 4 32 shutdown r r i i 1 100 k 40 k 40 k + ? c c c i i (bypass) (1) (1) c (bypass) is optional
17 TPA6204A1 www.ti.com slos429c ? may 2004 ? revised may 2016 product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated 11.1 power supply decoupling capacitor the TPA6204A1 device requires adequate power supply decoupling to ensure a high efficiency operation with low total harmonic distortion (thd). place a low equivalent series resistance (esr) ceramic capacitor, typically 0.1 f, as close as possible of the vdd pin. this choice of capacitor and placement helps with higher frequency transients, spikes, or digital hash on the line. also is recommended to place a 2.2- f to 10- f capacitor on the vdd supply trace. this larger capacitor acts as a charge reservoir, providing energy faster than the board supply, thus helping to prevent any droop in the supply voltage. 12 layout 12.1 layout guidelines it is important to keep the TPA6204A1 external components very close to the TPA6204A1 to limit noise pickup. 12.2 layout example figure 20. TPA6204A1 layout recommendation shutdown in in + - out + out - via to bottom ground plane top layer ground plane top layer traces pad to top layer ground plane thermal pad decoupling capacitor placed as close as possible to the device TPA6204A1 12 3 4 87 6 5 via to power supply
18 TPA6204A1 slos429c ? may 2004 ? revised may 2016 www.ti.com product folder links: TPA6204A1 submit documentation feedback copyright ? 2004 ? 2016 , texas instruments incorporated 13 device and documentation support 13.1 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 13.2 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 13.3 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 13.4 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 14 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation.
package option addendum www.ti.com 15-apr-2017 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples hpa00398drbr active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 85 ayj TPA6204A1drb active son drb 8 121 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 85 ayj TPA6204A1drbg4 active son drb 8 121 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 85 ayj TPA6204A1drbr active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 85 ayj TPA6204A1drbrg4 active son drb 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 85 ayj (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device.
package option addendum www.ti.com 15-apr-2017 addendum-page 2 (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TPA6204A1drbr son drb 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 TPA6204A1drbr son drb 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 q2 package materials information www.ti.com 8-feb-2016 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TPA6204A1drbr son drb 8 3000 367.0 367.0 35.0 TPA6204A1drbr son drb 8 3000 367.0 367.0 35.0 package materials information www.ti.com 8-feb-2016 pack materials-page 2

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